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    CHO-BOND? 1085 and 1086硅膠底漆原版技術資料

    下載次數:121 瀏覽次數:173發布時間:2017-02-06 11:46
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    文檔詳情

    Customer Value Proposition:

    Parker Chomerics CHO-BOND primers 1085 and 1086 are air-drying liquid coatings used

    to improve the adhesion of Parker Chomerics CHO-BOND conductive silicone compounds

    to metal and other non-silicone substrates.The primers are moisture reactive and

    clear in color. CHO-BOND 1085 primer is formulated to achieve maximum adhesion

    on non-silicone substrates for CHO-BOND 1029 adhesive. CHO-BOND 1086 primer

    is formulated for use with CHO-BOND 1016,1030, 1035, 1038, 1075 electrically

    conductive adhesives/sealants and CHOTHERM? 1641 thermal compound.

    CHO-BOND? 1085 and 1086 Silicone Adhesive Primers

    1. Surfaces to be joined must be clean, dry and oil free. In a well-ventilated area, clean the

    substrates with isopropyl alcohol (IPA) and let the solvent flash off.

    (Other solvents, such as methylethyl-ketone (MEK), toluene, or

    acetone can be used to clean difficult to remove contaminants).

    2. Wet a lint-free cotton cloth with the primer and apply to the surface in horizontal and vertical

    strokes. Keep the surface wet at all times. A cotton swab is a common

    applicator for a grooved or stepped surface.

    NOTE: Due to the low flash point temperature of the primer, ensure that the container is re-sealed immediately after use.

    Typical Applications:

    For best bonding results, use the following procedure:

    Note that typically, the proper primer comes bundled as a “kit” with the CHO-BOND or CHO-THERM compound ordered. However,

    if extra primer is deemed necessary, then part numbers for just the primer are provide in Table 2. See the Conductive Compounds

    Selector Guide for a more detailed listing of which CHO-BOND adhesive / sealant part numbers come packaged as a kit with the

    primer and which do not.

    3. The primed surface must cure for 30 minutes at room temperature. A relative humidity of 40% to 70% is optimal. A low humidity level

    may require a longer cure time.

    NOTE: There is no elevated temperature cure time for the primer.

    4. Apply the CHO-BOND / CHOTHERM adhesive / sealant per that product’s instructions.

    NOTE: If the primer has been applied for more than 4 hours without the application of the adhesive / sealant, repeat steps 1 through 4.

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